, AT49F001N, Aplikacje data 

AT49F001N

AT49F001N, Aplikacje data
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Features

Single Voltage Operation
– 5V Read
– 5V Reprogramming

Fast Read Access Time - 55 ns

Internal Program Control and Timer

Sector Architecture
– One 16K Byte Boot Block with Programming Lockout
– Two 8K Byte Parameter Blocks
– Two Main Memory Blocks (32K, 64K) Bytes

Fast Erase Cycle Time - 10 seconds

Byte By Byte Programming - 10
m
s/Byte Typical

Hardw
are Data Protection

DATA Polling for End of Program Detection

Low Power Dissipation
– 50 mA Active Current
– 100
m
A CMOS Standby Current

Typical 10,000 Write Cycles
1-Megabit
(128K x 8)
5-volt Only
Flash Memory
Description
The AT49F001(N)(T) is a 5-volt-only in-system reprogrammable Flash Memory. Its 1
megabit of memory is organized as 131,072 words by 8 bits. Manufactured with
Atmel’s advanced nonvolatile CMOS technology, the device offers access times to 55
ns with power dissipation of just 275 mW over the commercial temperature range.
AT49F001
AT49F001N
AT49F001T
AT49F001NT
(continued)
Pin Configurations
DIP Top View
Pin Name
Function
* RESET
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
I/O1
I/O2
GND
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
WE
NC
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
A0 - A16
Addresses
CE
Chip Enable
OE
Output Enable
WE
Write Enable
RESET
RESET
I/O0 - I/O7
Data Inputs/Outputs
NC
No Connect
DC
Don’t Connect
VSOP Top View (8 x 14 mm) or
TSOP Top View (8 x 20 mm)
Type 1
PLCC Top View
A11
A9
A8
A13
A14
NC
WE
VCC
* RESET
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
OE
A10
CE
I/O7
I/O6
I/O5
I/O4
I/O3
GND
I/O2
I/O1
I/O0
A0
A1
A2
A3
A7
A6
A5
A4
A3
A2
A1
A0
I/O0
5
6
7
8
9
10
11
12
13
29
28
27
26
25
24
23
22
21
A14
A13
A8
A9
A11
OE
A10
CE
I/O7
Rev. 1008B–07/98
*Note: This pin is a DC on the AT49F001N(T).
1
     When the device is deselected, the CMOS standby current
is less than 100
The device is erased by executing the erase command
sequence; the device internally controls the erase opera-
tions. There are two 8K byte parameter block sections and
two main memory blocks.
The device has the capability to protect the data in the boot
block; this feature is enabled by a command sequence.
The 16K-byte boot block section includes a reprogramming
lock out feature to provide data integrity. The boot sector is
designed to contain user secure code, and when the fea-
ture is enabled, the boot sector is protected from being
reprogrammed.
In the AT49F001N(T), once the boot block programming
lockout feature is enabled, the contents of the boot block
are permanent and cannot be changed. In the
AT49F001(T), once the boot block programming lockout
feature is enabled, the contents of the boot block cannot be
changed with input voltage levels of 5.5 volts or less.
A. For the AT49F001NT pin 1 for the DIP
and PLCC packages and pin 9 for the TSOP package are
don’t connect pins.
To allow for simple in-system reprogrammability, the
AT49F001(N)(T) does not require high input voltages for
programming. Five-volt-only commands determine the read
and programming operation of the device. Reading data
out of the de
vice
is s
imilar
to r
eading from an EPROM; it
has standard CE, OE, and WE inputs to avoid bus conten-
tion. Reprogramming the AT49F001(N)(T) is performed by
erasing a block of data and then programming on a byte by
byte basis. The byte programming time is a fast 50
m
s. The
end of
a program cycle can be optionally detected by the
DATA polling feature. Once the end of a byte program
cycle has been detected, a new access for a read or pro-
gram can begin. The typical number of program and erase
cycles is in excess of 10,000 cycles.
m
Block Diagram
AT49F001(N)
DATA INPUTS/OUTPUTS
I/O7 - I/O0
AT49F001(N)T
DATA INPUTS/OUTPUTS
I/O7 - I/O0
V
CC
GND
8
8
INPUT/OUTPUT
BUFFERS
INPUT/OUTPUT
BUFFERS
OE
WE
CE
RESET
CONTROL
LOGIC
PROGRAM
DATA LATCHES
PROGRAM
DATA LATCHES
Y DECODER
Y-GATING
Y-GATING
1FFFF
1FFFF
ADDRESS
INPUTS
MAIN MEMORY
BLOCK 2
(64K BYTES)
BOOT BLOCK
(16K BYTES)
X DECODER
1C000
1BFFF
10000
0FFFF
PARAMETER
BLOCK 1
(8K BYTES)
MAIN MEMORY
BLOCK 1
(32K BYTES)
1A000
19FFF
08000
07FFF
PARAMETER
BLOCK 2
(8K BYTES)
PARAMETER
BLOCK 2
(8K BYTES)
18000
17FFF
06000
05FFF
MAIN MEMORY
BLOCK 1
(32K BYTES)
PARAMETER
BLOCK 1
(8K BYTES)
10000
0FFFF
04000
03FFF
MAIN MEMORY
BLOCK 2
(64K BYTES)
BOOT BLOCK
(16K BYTES)
00000
00000
AT49F001(N)(T)
2
 AT49F001(N)(T)
Device Operation
READ
:
Th
e A
T49F
001(N)(T) is
acc
essed like an EPROM.
When CE and OE are low and WE is high, the data stored
at the memory location determined by the address pins is
asserted on the outputs. T
he
ou
tpu
ts are put in the high
impedance state whenever CE or OE is high. This dual-line
control gives designers flexibility in preventing bus conten-
tion.
COMMAND SEQUENCES:
When the device is first pow-
ered on it will be reset to the read or standby mode
depending upon the state of the control line inputs. In order
to perform other device functions, a series of command
sequences are entered into the device. The command
sequences are shown in the Command Definitions table.
The comma
nd s
eq
uen
ces are wr
itte
n b
y ap
plying a low
pulse on th
e W
E or CE input with CE or WE low (respec-
tively) a
nd O
E
high
. The address is latched on the falling
edge of CE or WE, whichever oc
curs
las
t. T
he data is
latched by the first rising edge of CE or WE. Standard
microprocessor write timings are used. The address loca-
tions used in the command sequences are not affected by
entering th
e comm
and sequences.
RESET:
A RESET input
pin is p
rovided to ease some sys-
tem applications. When RESET is at a logic high level, the
device is
in its standard operating mode. A low level on the
RESET input halts the present device operation and puts
the outp
uts of the device in a high impedence state. If the
RESET pin makes a high to low transition during a program
or erase operation, the operation may not be sucessfully
completed and the operatio
n will ha
ve to be repeated after
a high level is applie
d to the
RESET pin. When a high level
is reasserted on the RESET pin, the device returns to the
read or standby mode, depending upon the state of the
control i
nputs. By applying a 12V
CHIP ERASE:
If the boot block lockout has been enabled,
the Chip Erase function will erase Parameter Block 1,
Parameter Block 2, Main Memory Block 1, and Main Mem-
ory Block 2 but not the boot block. If the Boot Block Lockout
has not been enabled, the Chip Erase function will erase
the entire chip. After the full chip erase the device will
return back to read mode. Any command during chip erase
will be ignored.
SECTOR ERASE
: As an alternative to a full chip erase, the
device is organized into sectors that can be individually
erased. There are two 8K-byte parameter block sections
and two main memory blocks. The 8K-byte parameter
block sections can be independently erased and repro-
grammed. The two main memory sections are designed to
be used as alternative memory sectors. That is, whenever
one of the blocks has been erased and reprogrammed, the
other block should be erased and reprogrammed before
the first block is again erased. The Sector Erase command
is a six bus c
ycle
operation. The sector address is latched
on the falling WE edge of the sixth cycle while the
30H
data
input command is latched at the rising ed
ge
of WE. The
sector erase starts after the rising edge of WE of the sixth
cycle. The erase operation is internally controlled; it will
automatically time to completion.
BYTE PROGRAMMING:
Once the memory array is
erased, the device is programmed (to a logical “0”) on a
byte-by-byte basis. Please note that a data “0” cannot be
programmed back to a “1”; only erase operations can con-
vert “0”s to “1”s. Programming is accomplished via the
internal device command register and is a 4 bus cycle
operation (please refer to the Command Definitions table).
The device will automatically generate the required internal
program pulses.
The pro
gram
cy
cle
has addresses latched on the falling
edge of WE or CE, whichev
er o
cc
urs
last, and the data
latched on the rising edge of WE or CE, whichever occurs
first. Progr
ammin
g is completed after the specified t
BP
cycle
time. The DATA polling feature may also be used to indi-
cate the end of a program cycle.
BOOT BLOCK PROGRAMMING LOCKOUT:
The device
has one designated block that has a programming lockout
feature. This feature prevents programming of data in the
designated block once the feature has been enabled. The
size of the block is 16K bytes. This block, referred to as the
boot block, can contain secure code that is used to bring up
the system. Enabling the lockout feature will allow the boot
code to stay in the device while data in the rest of the
device is updated. This feature does not have to be acti-
vated; the boot block’s usage as a write protected region is
optional to the user. The address range of the boot block is
00000 to 03FFF for the AT49F001(N) while the address
0.5V input signal to the
RESET pin, the boot block array can be reprogrammed
even if the boot block lockout feature has been enabled
(see Boot Block Programming Lockout Override section).
The RESET feature is not available for the AT49F001N(T).
ERASURE:
Before a byte can be reprogrammed, the main
memory block or parameter block which contains the byte
must be erased. The erased state of the memory bits is a
logical “1”. The entire device can be erased at one time by
using a 6-byte software code. The software chip erase
code consists of 6-byte load commands to specific address
locations with a specific data pattern (please refer to the
Chip Erase Cycle Waveforms).
After the software chip erase has been initiated, the device
will internally time the erase operation so that no external
clocks are required. The maximum time needed to erase
the whole chip is t
EC
. If the boot block lockout feature has
been enabled, the data in the boot sector will not be
erased.
±
3
range of the boot block is 1C000 to 1FFFF for the
AT49F001(N)T.
Once the feature is enabled, the data in the boot block can
no longer be erased or programmed with input voltage lev-
els of 5.5V or less. Data in the main memory block can still
be changed through the regular programming method. To
activate the lockout feature, a series of six program com-
mands to specific addresses with specific data must be
performed. Please refer to the Command Definitions table.
BOOT BLOCK LOCKOUT DETECTION:
A software
method is available to determine if programming of the boot
block section is locked out. When the device is in the soft-
ware product identification mode (see Software Product
Identification Entry and Exit sections) a read from address
location 00002H will show if programming the boot block is
locked out for the AT49F001(N) and a read from address
1C002H will show if programming the boot block is locked
out for the AT49F001(N)T. If the data on I/O0 is low, the
boot block can be programmed; if the data on I/O0 is high,
the program lockout feature has been activated and the
block cannot be programmed. The software product identi-
fication exit code should be used to return to standard
operation.
BOOT BLOCK PROGRAMMING LOCKOUT OVERRIDE:
The user can
override
the boot block programming lockout
by taking the RESET pin to 12 volts. By doing this, pro-
tected boot block data can be altered through
a chip e
rase,
sector erase or word programming. When the RESET pin is
brought back to TTL levels the boot block programming
lockout feature is again active. This feature is not available
on the AT49F001N(T).
PRODUCT IDENTIFICATION:
The product identification
mode identifies the device and manufacturer as Atmel. It
may be accessed by hardware or software operation. The
hardware operation mode can be used by an external pro-
grammer to identify the correct programming algorithm for
the Atmel product.
For details, see Operating Modes (for hardware operation)
or Software Product Identification. The manufacturer and
device code is the same for both modes.
DATA POLLING:
The AT49F001(N)(T) features DATA
polling to indicate the end of a program cycle. During a pro-
gram cycle an attempted read of the last byte loaded will
result in the complement of the loaded data on I/O7. Once
the program cycle has been completed, true
data
is valid
on all outputs and the next cycle may begin. DATA polling
may begin at any time during the pro
gram cy
cle.
TOGGLE BIT:
In addition to DATA polling the
AT49F001(N)(T) provides another method for determining
the end of a program or erase cycle. During a program or
erase operation, successive attempts to read data from the
device will result in I/O6 toggling between one and zero.
Once the program cycle has completed, I/O6 will stop tog-
gling and valid data will be read. Examining the toggle bit
may begin at any time during a program cycle.
HARDWARE DATA PROTECTION:
Hardware features
protect against inadvertent programs to the
AT49F001(N)(T) in the following ways: (a) V
CC
sense: if
V
CC
is below 3.8V (typical), the program func
tion
is in
hib-
ited. (b)
Pro
gram inhibit: holding any one of OE low, CE
high or WE high inhibits program cycles
. (c
) N
oise
filter:
pulses of less than 15 ns (typical) on the WE or CE inputs
will not initiate a program cycle.
AT49F001(N)(T)
4
 AT49F001(N)(T)
Command Definition (in Hex)
(1)
1st Bus
Cycle
2nd Bus
Cycle
3rd Bus
Cycle
4th Bus
Cycle
5th Bus
Cycle
6th Bus
Cycle
Command
Sequence
Bus
Cycles
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Addr
Data
Read
1
Addr
D
OUT
Chip Erase
6
5555
AA
2AAA
55
5555
80
5555
AA
2AAA
55
5555
10
SA
(4)
Sector Erase
6
5555
AA
2AAA
55
5555
80
5555
AA
2AAA
55
30
Byte Program
4
5555
AA
2AAA
55
5555
A0
Addr
D
IN
Boot Block Lockout
(2)
6
5555
AA
2AAA
55
5555
80
5555
AA
2AAA
55
5555
40
Product ID Entry
3
5555
AA
2AAA
55
5555
90
Product ID Exit
(3)
3
5555
AA
2AAA
55
5555
F0
Product ID Exit
(3)
1
XXXX
F0
Notes:
1.
The DATA FORMAT in each bus cycle is as follows: I/O7 - I/O0 (Hex)
2.
The 16K byte boot sector has the address range 00000H to 03FFFH for the AT49F001(N) and
1C000H to 1FFFFH for the AT49F001(N)T.
3.
Either one of the Product ID Exit commands can be used.
4.
SA = sector addresses
For the AT49F001(N):
SA = 10000 to 1FFFF for BOOT BLOCK
Nothing will happen and the device goes back to the read mode in 100 ns
SA = 04000 to 05FFF for PARAMETER BLOCK 1
SA = 06000 to 07FFF for PARAMETER BLOCK 2
SA = 08000 to 0FFFF for MAIN MEMORY ARRAY BLOCK 1
This command will erase - PB1, PB2 and MMB1
SA = 10000 to 1FFFF for MAIN MEMORY ARRAY BLOCK 2
For the AT49F001(N)T:
SA = 1C000 to 1FFFF for BOOT BLOCK
Nothing will happen and the device goes back to the read mode in 100 ns
SA = 1A000 to 1BFFF for PARAMETER BLOCK 1
SA = 18000 to 19FFF for PARAMETER BLOCK 2
SA = 10000 to 17FFF for MAIN MEMORY ARRAY BLOCK 1
This command will erase - PB1, PB2 and MMB1
SA = 00000 to 0FFFF for MAIN MEMORY ARRAY BLOCK 2
Absolute Maximum Ratings*
*NOTICE:
Stresses beyond those listed under “Absolute Maxi-
mum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional
operation of the device at these or any other condi-
tions beyond those indicated in the operational sec-
tions of this specification is not implied. Exposure to
absolute maximum rating conditions for extended
periods may affect device reliability.
Temperature Under Bias ................................ -55°C to +125°C
Storage Temperature ..................................... -65°C to +150°C
All Input Voltages
(including NC Pins)
with Respect to Ground ...................................-0.6V to +6.25V
All Output Voltages
with Respect to Ground .............................-0.6V to V
CC
+ 0.6V
Voltage on OE
with Respect to Ground ...................................-0.6V to +13.5V
5
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